NTA4153N, NTE4153N
PACKAGE DIMENSIONS
SC?89
CASE 463C?03
ISSUE C
A
?X?
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
K
1
3
2
B ?Y? S
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 463C?01 OBSOLETE, NEW STANDARD 463C?02.
MILLIMETERS
INCHES
G
2 PL
D
3 PL
DIM
A
B
C
MIN NOM MAX
1.50 1.60 1.70
0.75 0.85 0.95
0.60 0.70 0.80
MIN
0.059
0.030
0.024
NOM MAX
0.063 0.067
0.034 0.040
0.028 0.031
0.08 (0.003)
M
X Y
D
G
0.23 0.28 0.33
0.50 BSC
0.009
0.011 0.013
0.020 BSC
H
0.53 REF
0.021 REF
J
K
0.10 0.15 0.20
0.30 0.40 0.50
0.004
0.012
0.006 0.008
0.016 0.020
M
C
J
N
L
M
N
S
1.10 REF
??? ??? 10 _
??? ??? 10 _
1.50 1.60 1.70
???
???
0.059
0.043 REF
??? 10 _
??? 10 _
0.063 0.067
?T?
SEATING
PLANE
SOLDERING FOOTPRINT*
0.53
0.020
0.53
0.020
1.10
0.043
1.00
0.039
SCALE 10:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NTA4153N/D
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